Adapted from http://www.overclockers.co.nz, English      DATE: 2003-06-27

"The high speed is achieved from GeIL industry-leading engineering technology: Wafer Level Chip Scale Package (WLCSP). Each chip is directly mounted to the module PCB in its original wafer format and die size without any type of conventional packaging. Thus, there are no soldering legs as with the conventional method. This breakthrough technology would not only dramatically reduces the electro-magnetic noise, but the module also produces very little heat under stressed operation. The end result is high bus clock speed and low operational temperature. No heat spreader is required. And because of its low electro-magnetic noise (EMC), when equipped, the computer receives higher system-wide stability and greater over-clocking potential." ~http://www.overclockers.co.nz/

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